Cut all substrates with an accuracy of 10 micrometers

Your needs

• Precision cutting of bare planar crystals or already structured crystals (deposits or microcomponents)

Our solutions

• Disc saw for all materials up to 4 inches 
• Resin-bonded horizontal wire saw for maximum positioning accuracy up to 3 inches 
• Resin-bonded vertical wire saw for minimum mechanical stress suitable for thin and fragile substrates up to 3 inches
• "Wafer scriber" for silicon substrates up to 6 inches 

Keywords

• Cutting
• Scribbing
• Microcomponents

Related skills

• After cutting, the components can be fixed and electrically connected onto PCB cards
• For silicon, it is only possible to engrave with a diamond tip on "blue tape"  at the surface, for subsequent cleavage
• Micro and nanofabrication processes

Contact

• Contact the research group:
  juan-carlos.rojas-sanchez@univ-lorraine.fr
  + 33 (0) 3 72 74 25 78
   
• Contact the technology transfer office (TTO):
  ijl-tto@univ-lorraine.fr
  +33 (0) 3 72 74 26 04